| Technical details |
|---|
| PCI Express slots version | 4.0 |
| Processing Die size | 74 mm² |
| Graphics & IMC Die Size | 125 mm² |
| Supported instruction sets | AMD-V, AES, AVX, AVX 2.0, FMA3, MMX-plus, SHA, SSE2, SSE4.2, SSE4.1, SSE3, SSSE3, SSE, SSE4A, x86-64 |
| Compatible operating systems | Windows 11 - 64-Bit Edition , Windows 10 - 64-Bit Edition , RHEL x86 64-Bit , Ubuntu x86 64-Bit |
| Thermal Design Power (TDP) | 65 W |
| Market segment | Desktop |
| Launch date | 9/10/2026 |
| Processor cache type | L2 & L3 |
| Features |
|---|
| Thermal Design Power (TDP) | 65 W |
| PCI Express slots version | 4.0 |
| Processing Die size | 74 mm² |
| Graphics & IMC Die Size | 125 mm² |
| Supported instruction sets | AMD-V, AES, AVX, AVX 2.0, FMA3, MMX-plus, SHA, SSE2, SSE4.2, SSE4.1, SSE3, SSSE3, SSE, SSE4A, x86-64 |
| Compatible operating systems | Windows 11 - 64-Bit Edition , Windows 10 - 64-Bit Edition , RHEL x86 64-Bit , Ubuntu x86 64-Bit |
| Market segment | Desktop |
| I/O configuration |
|---|
| USB version | 3.2 Gen 2 (3.1 Gen 2) |
| Processor special features |
|---|
| Virtual Reality (VR) ready | Yes |
| Packaging data |
|---|
| Package type | Box |