Kingston Technology DC2000B 960 GB M.2 PCI Express 4.0 NVMe 3D TLC

SKU
SEDC2000BM8/960G
$231.25
In stock
960G DC2000B PCIe 4.0 M.2 2280 Enterprise SSD
  • PCIe 4.0 NVMe Gen 4x4 performance
  • Hardware-based power loss protection
  • Latency and IOPS consistency
  • Designed for data center environments
More Information
SKU SEDC2000BM8/960G
EAN 0740617345186
Manufacturer Kingston Technology
Availability In Stock
Product Videos View Video
PDF URLs View PDF
Enterprise class for server applications
Kingston’s DC2000B SSD is a high-performance boot drive designed for data centers using the latest Gen 4x4 PCIe interface with 3D TLC NAND. With low latency, IOPS consistency and hardware-based power loss protection, it ensures reliability and efficiency. Available in capacities of up to 960GB, it's ideal for enterprise server boot and caching applications. 

Kingston DC2000B is a high-performance PCIe 4.0 NVMe M.2 SSD using a Gen 4x4 PCIe controller and 3D TLC NAND. Ideally suited for use in high-volume rack-mount servers as an internal boot drive(s) to preserve valuable front-loading drive bays, as well as for use in purpose-built systems where a high-performance M.2 SSD is needed that includes hardware-based on-board power loss protection (PLP). New for DC2000B is an integrated aluminium heatsink that offers broader thermal compatibility for a wide range of systems. DC2000B delivers low latency and excellent IO consistency to handle various workloads from boot drive applications to high-speed application caching. DC2000B is rated at 0.4 DWPD write endurance and carries a 5-year warranty."

PCIe 4.0 NVMe performance
Utilises PCIe Gen 4x4 lanes for high-performance speeds.

On-board power loss protection (PLP)
Reduce the possibility of data loss and/or corruption due to unexpected power-off.

Low latency and IOPS consistency
Firmware optimised to deliver low latency and IO consistency for high duty cycle workloads.

Designed for data center environments
Optimised to meet the demands of server boot applications with low latency and IO consistency as the key design criteria.
Hard drive
PCI Express interface data lanesx4
SSD capacity960 GB
Memory type3D TLC
Data transmission
Read speed7000 MB/s
Write speed1300 MB/s
Random write (4KB)47000 IOPS
Random read (4KB)540000 IOPS
Write latency20 µs
Read latency70 µs
Endurance
Mean time between failures (MTBF)2000000 h
Features
InterfacePCI Express 4.0
Component forServer
NVMeYes
TBW rating700
PCI Express interface data lanesx4
SSD capacity960 GB
S.M.A.R.T. supportYes
Read speed7000 MB/s
Write speed1300 MB/s
Memory type3D TLC
Random write (4KB)47000 IOPS
Random read (4KB)540000 IOPS
Mean time between failures (MTBF)2000000 h
Write latency20 µs
Read latency70 µs
SSD form factorM.2
H/W PLP functionYes
M.2 SSD size2280 (22 x 80 mm)
Drive writes per day (DWPD)0.4
Power
Power consumption (write)7.8 W
Power consumption (read)3.36 W
Average power consumption (write)7.36 W
Average power consumption (read)3.26 W
Performance
InterfacePCI Express 4.0
Component forServer
NVMeYes
TBW rating700
PCI Express interface data lanesx4
SSD capacity960 GB
S.M.A.R.T. supportYes
Read speed7000 MB/s
Write speed1300 MB/s
Memory type3D TLC
Random write (4KB)47000 IOPS
Random read (4KB)540000 IOPS
Mean time between failures (MTBF)2000000 h
Write latency20 µs
Read latency70 µs
Design
Component forServer
Cooling typeHeatsink
SSD form factorM.2
Weight & dimensions
Width0.866" (22 mm)
Weight0.388 oz (11 g)
Height0.35" (8.9 mm)
Depth3.15" (80 mm)
Package width5.1" (129.5 mm)
Package depth0.56" (14.2 mm)
Package height7.25" (184.2 mm)
Package weight1.26 oz (35.8 g)
Packaging data
Package width5.1" (129.5 mm)
Package depth0.56" (14.2 mm)
Package height7.25" (184.2 mm)
Package weight1.26 oz (35.8 g)
Master (outer) case width5.35" (135.9 mm)
Master (outer) case length8" (203.2 mm)
Master (outer) case height2.75" (69.8 mm)
Master (outer) case gross weight10.3 oz (292.6 g)
Products per master (outer) case6 pc(s)
Operational conditions
Operating temperature (T-T)0 - 70 °C
Storage temperature (T-T)-40 - 85 °C
Non-operating vibration20 G
Technical details
InterfacePCI Express 4.0
S.M.A.R.T. supportYes
Operating temperature (T-T)0 - 70 °C
Storage temperature (T-T)-40 - 85 °C
Non-operating vibration20 G
Country of originChina, Taiwan
SSD form factorM.2
Other features
Cooling typeHeatsink
Country of originChina, Taiwan
Logistics data
Master (outer) case width5.35" (135.9 mm)
Master (outer) case length8" (203.2 mm)
Master (outer) case height2.75" (69.8 mm)
Master (outer) case gross weight10.3 oz (292.6 g)
Products per master (outer) case6 pc(s)
Country of originChina, Taiwan

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SKU
SEDC2000BM8/960G
MZ-V7S1T0B/AM
P19888-B21
02-SSC-3117
MZ-77E1T0E
P40497-B21
Manufacturer
Kingston Technology
Samsung
HPE
SonicWall
Samsung
HPE
Interface
PCI Express 4.0
PCI Express 3.0
Serial ATA
PCI Express
Serial ATA III
Serial ATA
Memory type
3D TLC
V-NAND MLC
TLC
N/A
N/A
TLC
SSD capacity
800GB to 1000GB
800GB to 1000GB
200GB to 250GB
250GB to 300GB
800GB to 1000GB
400GB to 500GB
Component for
Server
PC
Server/workstation
NAS
Universal
Server
SSD form factor
M.2
M.2
M.2
M.2
2.5"
2.5"